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The method is used in a variety of industrial and laboratory processes, including electronic component assembly, optoelectronics, optics, biochemical engineering, food science, decontamination of hazardous wastes, and geochemical analysis. The two most common types of reflow profiles are the ramp-to-peak profile, also called ramp-to-spike or tent profile and the soak profile, or ramp/soak/spike profile. A Reflow oven is a machine used primarily for Reflow soldering of surface mount electronic components to printed circuit boards (PCB). For example, if the process mean is set at 200 ☌ with the process window calibrated at 180 ☌ and 220 ☌ respectively, then a measured value of 188 ☌ translates to a process window index of −60%. A PWI of 99% indicates that the profile is within process limitations, but runs at the edge of the process window. A Process Window Index (PWI) greater than or equal to 100% indicates the profile is outside of the process limitations. The center of the process window is defined as zero, and the extreme edges of the process window are ☙9%. This starting point recipe can be further refined to center the profile in the process window by profiling the oven using.
#Reflow oven profiling software#
Many reflow ovens feature automatic recipe set up software allowing the oven to create a starting point recipe based on the board characteristics and solder paste specification. Raw temperature values are normalized in terms of a percentage relative to both the process mean and the window limits. Reflow Oven Recipe Set Up and Oven Profiling. The award winning KIC thermal profilers provide accurate and quick reflow profiling, as well as optimum reflow oven set up. An oven temperature profiler is used to monitor the internal temperature of your Reflow oven, it is designed to provide accurate data about the temperature. Compact datalogger used for the capture of thermal profiles from a reflow oven A graphical representation of the Process Window Index for a thermal profileĪ thermal profile can be ranked on how it fits in a process window (the specification or tolerance limit). Reflow oven profiling can be a tedious, expensive, and time-consuming process. solder reflow profile mole profiler reflow oven temperature profile reflow soldering temperature KIC slim 2000 Thermal Shield 1/8 (3.2mm), 9CH. The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus (TAL), and peak. A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven).
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